Nail Head Bonder@j|QOVsr
This equipment is to connect wire as wire connection device, which is used bonding tool, prescribed position of heated integrated circuit by wire. The wire is used 0.05mm gold wire.
Sample fixing By vacuum
Temperature of stage Room temp. `200 or more
X,Y axes displacement iby manipulatorj 40mm,5m/1gauge
X,Y axes displacement 6mm
Z axis displacement 10mm or more
Using wire Gold wire 50m
Microscope stand 24.5mm
Power supplyd AC100V 3A
Dimension W 730~D 530~H 500mm
Weight Approx. 30kg
Option Microscope,AAngle jigAVacuum pump

Kyowa Riken Co., Ltd.
3-37-3 Izumi, Suginami-Ku, Tokyo 168-0063, Japan