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| ＜Nail Head Bonder＞ Ｋ－２０７ＴＳ |
| This equipment is to connect wire as wire connection device, which is used
bonding tool, prescribed position of heated integrated circuit by wire. The wire
is used 0.05mm gold wire. |
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| Sample fixing |
By vacuum |
| Temperature of stage |
Room temp. ～200℃ or more |
| X,Y axes displacement （by manipulator） |
40mm,5μm/1gauge
500μm/turn |
| X,Y axes displacement |
6mmφ |
| Z axis displacement |
10mm or more |
| Using wire |
Gold wire 50μm |
| Microscope stand |
24.5mmφ |
| Power supply電源入力 |
AC100V 3A |
| Dimension |
W 730×D 530×H 500mm |
| Weight |
Approx. 30kg |
| Option |
Microscope,、Angle jig、Vacuum pump |
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Kyowa Riken Co., Ltd. |
3-37-3 Izumi, Suginami-Ku, Tokyo 168-0063, Japan
TEL ０３（３３２１）９９１１ FAX ０３（３３２１）９９１７
E-MAIL:sales@kyowariken.co.jp |
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